High-power power supply PCBA serves as the "power heart" in industrial and new energy fields. Its design and manufacturing must balance performance, reliability while meeting the growing demands for high power and efficiency.
Heat dissipation is a key focus, as high-power operation generates significant heat, necessitating PCB layout optimization—such as using large-area copper foil for heat conduction—and the application of thermal materials like thermal grease. Electromagnetic Compatibility (EMC) is equally important, with measures like shielding covers and filter circuits employed to suppress high-frequency interference. To ensure energy efficiency and reliability, these PCBA must meet high conversion efficiency standards, like the 80 Plus certification, and maintain long-term stable operation. In terms of production, both SMT and DIP techniques are utilized; SMT enables high-precision soldering of small components such as capacitors and chips, while DIP is used for inserting larger components like transformers and heat sinks. Rigorous testing procedures, including load testing to simulate full-load operation, withstand voltage testing for safety, and burn-in testing to verify long-term stability, are also integral to the manufacturing process.
